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Cyberoptics Semiconductor - WaferSense® Auto Vibration and Leveling Sensor™ AVLS3

Speed equipment qualification with wireless measurements.

Shorten equipment maintenance cycles with thin and lightweight wafer-like form factor.

Lower equipment maintenance expenses and enhance process uniformity with objective and reproducible data.

Wireless, wafer-shaped and battery-powered: Available in 300mm.

Reports inclination in two dimensions: x, and y

Reports Accelerations in three dimensions: x, y and z

Thin: 3.5mm, laminated chemically hardened glass substrate.

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