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- TS Series


TS Series
Specialized furnaces for R&D, MEMS, Photonics, Semiconductors

1-4 tubes configuration, 4” – 12” wafer size

Maximum flexibility in configuration (e.g. # tubes, process configuration and flat-zone length)

Diffusion, Oxidation and PECVD and LPCVD deposition processes (e.g. Dry/Wet Oxidation, Nitride, TEOS, Poly etc.)

Flat-zone temperature control within ±0,5 °C

Temperature max 1300 °C

Direct Contact