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AEHR Test Systems - FOX-CP Full Wafer Test System

Compact Solution for High Throughput Reliability Verification and Test

Capable of testing thousands of die in a single touchdown

Identifies failing logic/memory/photonic die before final package integration

Integrated system with wafer handling and stepping capabilities

Full-wafer test system using a WaferPak™ contactor And wafer prober available with a high performance thermal chuck for high power wafer requirements

Configurable Channel Resources for Full-Wafer Test and Reliability Verification

Multiple resource modules are available: Universal Channel Modules, High Voltage Channel

Modules or High Current Channel Modules

Up to 2,048 “Universal Channel” resources: (I/O / Clock / PPMU / DPS) with deep scan, pattern data and capture memory per channel for test of devices with BIST/DFT

Up to 1,024 high voltage (29 V) or high current (2 A) Sources resources

Production Proven Full-Wafer Reliability Verification & Test Solution

Reduces test cost by functionally testing wafer during reliability verification

Compatible with industry standard probers and probe cards

Protects wafers and probe cards with per channel over-current and over-voltage protection

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